Custom Training

Get in-depth training on:

  • Current and future regulatory requirements

  • Designing right for faster EMI compliance

  • Solving emissions and susceptibility problems

  • Grounding techniques for reducing emissions

  • Planning and designing for safety agency approvals

Our in-depth training seminars custom tailored to meet your specific needs.

Contact us or complete the form below to set up your custom training seminar

Your principal course instructor will be Mr. Shirish Shah. Mr. Shah has a BSEE from the Indian Institute of Technology, Bombay and an MSEE from the University of Hawaii.

Mr. Shah has over 25 years experience designing equipment and systems, including 20 years of design and consulting in the field of electromagnetic compatibility. This extensive design experience includes analog, digital, RF and power circuits and systems in the commercial and military sectors.

Other instructors will include members of Compatible Electronics' staff and prominent individuals in the field.


Sample Of Our Training Program Topics

EMC Design Part I


  • Terms & definitions

  • EMI situations

  • Modes of noise propagation

  • Noise transmission paths

  • Units of EMI measurement

  • Radiated and conducted noise

  • Electric & magnetic field sources

  • Wave impedance and plane waves

  • Common-mode vs differential

  • Near-field vs far-field

  • Narrowband and broadband noise

  • Freq. vs wavelength relationship

  • Transmission of signal energy

  • Chassis as noise source, or sink?

Grounding Techniques

  • Considerations for grounding

  • Grounding definitions

  • Personnel safety objectives

  • EMC grounding objectives

  • Ground loop problems

  • Single-point grounding -When?

  • Multi-point grounding - Why?

  • Audio-frequency grounding

  • Digital / RF grounding

  • Grounding according to noise level

  • Ground as a return path

  • Mutual inductance of ground path

  • Common-mode coupling

  • Ground reference for RF

Noise Emission Evaluation

  • Purpose of EMC analysis

  • Analysis as a design tool

  • Basis for RFI generation

  • Application of Fourier transforms

  • Signal transition time and bandwidth

  • Conducted emission levels

  • Setup for conducted emissions test

  • Radiated emission levels

  • Noise suppression computation

Shielding & Filtering

  • Basics of shielding process

  • Reflection and multiple reflection

  • Absorption loss computation

  • Wave and characteristic impedance

  • Computing reflection loss

  • Total shielding effectiveness

  • Effectiveness of Faraday Cage

  • Induced noise and return path

  • Shielding effectiveness of cables

  • Capacitive coupling on cables

  • Cable as a transmission line

  • Reflections on a transmission line

  • Ribbon vs round cable

  • Isolation techniques for cables

  • Power line filtering

EMC Design Part II

System And PWB

  • System design considerations

  • Suppression at the source

  • Compartmentalized shielding

  • Power distribution on PWB

  • Selection of decoupling capacitors

  • Effect of trace inductance

  • Power distribution for 2 layer system

  • Signal layout for high frequencies

  • Optimizing Multilayer Boards

  • Correct order of layers

  • Transmission line

  • Thickness of dielectric

  • Ground as shield

  • Pin escape length

  • Use of decoupling capacitors

  • Signal routing, best practices

  • Buried clock layout

  • Guard band for clocks

  • Routing of high frequencies

  • Preferred layer groups

  • Four-layer PWB

  • Six-layer PWB

  • Eight-layer Plus

  • Too many layers?

  • Demonstration


  • ESD as RF noise

  • ESD test setup

  • ESD characteristics

  • Direct and indirect ESD

  • ESD through cables

  • RF Susceptibility

  • Noise paths for RF

  • Conducted susceptibility

  • Power line transients

Special Topics

  • Telephone line

  • Local area networks

  • Medical devices

  • Transmitters & Receivers

Diagnostic & Demo

  • Spectrum energy

  • Near field probes

  • Wire antennas

  • Cable antennas

  • Shielding materials

  • Filtering materials

  • EMC testing and debugging



  • Intro to regulatory requirements

  • Agencies in North America

  • Agencies in Europe

  • Structure of agencies

  • Commonalities in other regions

  • Participation in standards making

North America

  • US requirements-digital devices

  • Changes in FCC's policies

  • PCs and peripherals - special case

  • Class A or class B limits?

  • US req. - intentional radiator

  • Introduction to TCBs

  • TCB Roles and Responsibilities

  • TCB trends and statistics

European Union (EU)

  • New Legislative Framework

  • EMC directive 2014/30/EU

  • Scope and exclusions

  • Compliance path to CE mark

  • Declaration of Conformity

  • Generic/product specific stds.

  • ITE standards for EMC

  • Immunity and emissions testing

  • FCC vs EC (CE) emission limits

  • What is a "CAB"?

  • What is a notified body?

  • Technical Construction File (TCF)

  • When to use the Type Examination route

  • Future trends for the EU

  • Radio Equipment Directive 2014/53/EU directive

Product Safety

Terms & Definitions

  • Enclosures

  • Hazards

  • Equipment types & classes

  • Power systems

  • Environment

Standards & Laws

  • North America

  • South America

  • Europe

  • Nordic Countries

  • Russia

  • Japan, China, Korea

  • Australia, New Zealand

Basic Safety Principles

  • Concepts of safety

  • Design for foreseeable misuse

  • Approaches to product safety

  • Prevention of hazards

  • Containment of hazard

Design Characteristics

  • Thermal Hazards

  • Shock Hazards

  • Mechanical hazards

  • Chemical hazards

  • Radiation hazards

  • Ergonomics

Qualification (Type)

  • Input ratings, touch current

  • Ground impedance, temperature rise

  • Dielectric withstand, impact

  • Stability, abnormal testing

Production Line Testing

  • Dielectric withstand

  • Ground impedance

  • Ground continuity


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