Get in-depth training on:
Current and future regulatory requirements
Designing right for faster EMI compliance
Solving emissions and susceptibility problems
Grounding techniques for reducing emissions
Planning and designing for safety agency approvals
Sample training material
PDF (129KB) 11/9/2005 written and presented by Shirish Shah as presented to the OC IEEE EMC Society
If you think EMC compliance is challenging or expensive, EMI/EMC seminars are a good choice for your business. Seminars help a variety of individuals involved in the product design and development process.
These seminars are intended for design engineers and technical project managers involved in regulatory compliance of digital and RF equipment. Design fundamentals related to EMI/EMC and digital circuit designs will be explained thoroughly.
Here are a few groups that may benefit from the seminar:
Digital design and mechanical engineers and project managers
EMI test engineers/technicians
PWB layout persons
System integrators
Any business that creates electronic devices may benefit from such a seminar. A wide range of businesses produce electronics and need to know about EMC design, including those in the medical, automotive and consumer electronics industries.
Companies that produce modern electronic devices must submit products to EMI or EMC testing to ensure they conform with specific national requirements. People designing electronic devices can use EMI/EMC training to create more compatible designs early on — without many rounds of costly and time-consuming redesigns.
Electromagnetic compatibility (EMC) is an ability of a device to work in environments with other electronic devices without causing issues. Electromagnetic interference (EMI) is a disturbance that affects device performance. Other devices are the most common cause of interference, but interference can also come from solar radiation and electric storms. Device designers should focus on EMC designs that eliminate EMI
There are many benefits of learning more about EMC and EMI, such as understanding regulatory requirements to ensure devices meet requirements before testing and getting products to market faster.
What's involved in EMI/EMC training seminars?
EMI/EMC workshops involve instruction and various demonstrations to teach people who produce electronic devices about the fundamentals of EMI/EMC design. Compatible Electronics uses experienced professionals with an in-depth knowledge of relevant product design topics.
Seminars from Compatible Electronics cover a range of expertise, from beginner-level classes to more specified programs. Here are our four main topic offerings:
EMC Design Part 1: Courses in this category cover the basics of EMC design, including what it is and common causes of interference. Courses also cover the basics of grounding techniques, noise emission evaluation and shielding and filtering.
EMC Design Part 2: This section follows up on the lessons of Part 1, offering more specific information on specialized topics.
Regulatory: Courses in this category cover the regulatory requirements that devices must meet to sell in regions like North America and the European Union.
Product Safety: In this category, you can learn basic safety principles, how to design and test products and ways to conform to specific safety laws.
Contact us about EMI/EMC Training Courses
EMI/EMC training will help your business attain better efficiency from the outset of the design phase. Training allows your engineers and technicians to create electronic devices that operate well and meet the compliance requirements of the European Union and North America.
If you're interested in decreasing the time it takes to bring your products to market through EMI/EMC training,contact us to learn more about our training courses and other ways we help you meet compliance needs.
“CETCB personal cannot offer consulting and/or design services while at the same time provides TCB services. If clients want to obtain these services Compatible Electronics, Inc. can submit your project to a third party TCB”
EMC Design Part I
Terms & definitions
EMI situations
Modes of noise propagation
Noise transmission paths
Units of EMI measurement
Radiated and conducted noise
Electric & magnetic field sources
Wave impedance and plane waves
Common-mode vs differential
Near-field vs far-field
Narrowband and broadband noise
Freq. vs wavelength relationship
Transmission of signal energy
Chassis as noise source, or sink?
Considerations for grounding
Grounding definitions
Personnel safety objectives
EMC grounding objectives
Ground loop problems
Single-point grounding -When?
Multi-point grounding - Why?
Audio-frequency grounding
Digital / RF grounding
Grounding according to noise level
Ground as a return path
Mutual inductance of ground path
Common-mode coupling
Ground reference for RF
Purpose of EMC analysis
Analysis as a design tool
Basis for RFI generation
Application of Fourier transforms
Signal transition time and bandwidth
Conducted emission levels
Setup for conducted emissions test
Radiated emission levels
Noise suppression computation
Basics of shielding process
Reflection and multiple reflection
Absorption loss computation
Wave and characteristic impedance
Computing reflection loss
Total shielding effectiveness
Effectiveness of Faraday Cage
Induced noise and return path
Shielding effectiveness of cables
Capacitive coupling on cables
Cable as a transmission line
Reflections on a transmission line
Ribbon vs round cable
Isolation techniques for cables
Power line filtering
EMC Design Part II
System design considerations
Suppression at the source
Compartmentalized shielding
Power distribution on PWB
Selection of decoupling capacitors
Effect of trace inductance
Power distribution for 2 layer system
Signal layout for high frequencies
Optimizing Multilayer Boards
Correct order of layers
Transmission line
Thickness of dielectric
Ground as shield
Pin escape length
Use of decoupling capacitors
Signal routing, best practices
Buried clock layout
Guard band for clocks
Routing of high frequencies
Preferred layer groups
Four-layer PWB
Six-layer PWB
Eight-layer Plus
Too many layers?
Demonstration
ESD as RF noise
ESD test setup
ESD characteristics
Direct and indirect ESD
ESD through cables
RF Susceptibility
Noise paths for RF
Conducted susceptibility
Power line transients
Telephone line
Local area networks
Medical devices
Transmitters & Receivers
Spectrum energy
Near field probes
Wire antennas
Cable antennas
Shielding materials
Filtering materials
EMC testing and debugging
Regulatory
Intro to regulatory requirements
Agencies in North America
Agencies in Europe
Structure of agencies
Commonalities in other regions
Participation in standards making
US requirements-digital devices
Changes in FCC's policies
PCs and peripherals - special case
Class A or class B limits?
US req. - intentional radiator
Introduction to TCBs
TCB Roles and Responsibilities
TCB trends and statistics
New Legislative Framework
EMC directive 2014/30/EU
Scope and exclusions
Compliance path to CE mark
Declaration of Conformity
Generic/product specific stds.
ITE standards for EMC
Immunity and emissions testing
FCC vs EC (CE) emission limits
What is a "CAB"?
What is a notified body?
Technical Construction File (TCF)
When to use the Type Examination route
Future trends for the EU
Radio Equipment Directive 2014/53/EU directive
Product Safety
Enclosures
Hazards
Equipment types & classes
Power systems
Environment
North America
South America
Europe
Nordic Countries
Russia
Japan, China, Korea
Australia, New Zealand
Concepts of safety
Design for foreseeable misuse
Approaches to product safety
Prevention of hazards
Containment of hazard
Thermal Hazards
Shock Hazards
Mechanical hazards
Chemical hazards
Radiation hazards
Ergonomics
Input ratings, touch current
Ground impedance, temperature rise
Dielectric withstand, impact
Stability, abnormal testing
Dielectric withstand
Ground impedance
Ground continuity