Training Seminars

Learn how to reduce time and cost of EMC and product safety compliance

Get in-depth training on:
  • Current and future regulatory requirements
  • Designing right for faster EMI compliance
  • Solving emissions and susceptibility problems
  • Grounding techniques for reducing emissions
  • Planning and designing for safety agency approvals
Sample training material

"Grounding Demystified" PDF (129KB) 11/9/2005 written and presented by Shirish Shah as presented to the OC IEEE EMC Society

EMC design and regulatory seminar
May 9 to 11, 2018 - Westlake Village, CA

Who should attend?

These seminars are intended for design engineers and technical project managers involved in regulatory compliance of digital and RF equipment. Design fundamentals related to EMI/EMC and digital circuit designs will be explained thoroughly.

  • a. Digital design and mechanical engineers & project managers.
  • b. EMI test engineers / technicians.
  • c. PWB layout persons.
  • d. If you think EMC compliance is difficult and/or expensive.

Sample of our training program topics

EMC Design Part I

Introductions

  1. Terms & definitions
  2. EMI situations
  3. Modes of noise propagation
  4. Noise transmission paths
  5. Units of EMI measurement
  6. Radiated and conducted noise
  7. Electric & magnetic field sources
  8. Wave impedance and plane waves
  9. Common-mode vs differential
  10. Near-field vs far-field
  11. Narrowband and broadband noise
  12. Freq. vs wavelength relationship
  13. Transmission of signal energy
  14. Chassis as noise source, or sink?

Grounding Techniques

  1. Considerations for grounding
  2. Grounding definitions
  3. Personnel safety objectives
  4. EMC grounding objectives
  5. Ground loop problems
  6. Single-point grounding -When?
  7. Multi-point grounding - Why?
  8. Audio-frequency grounding
  9. Digital / RF grounding
  10. Grounding according to noise level
  11. Ground as a return path
  12. Mutual inductance of ground path
  13. Common-mode coupling
  14. Ground reference for RF

Noise Emission Evaluation

  1. Purpose of EMC analysis
  2. Analysis as a design tool
  3. Basis for RFI generation
  4. Application of Fourier transforms
  5. Signal transition time and bandwidth
  6. Conducted emission levels
  7. Setup for conducted emissions test
  8. Radiated emission levels
  9. Noise suppression computation

Shielding & Filtering

  1. Basics of shielding process
  2. Reflection and multiple reflection
  3. Absorption loss computation
  4. Wave and characteristic impedance
  5. Computing reflection loss
  6. Total shielding effectiveness
  7. Effectiveness of Faraday Cage
  8. Induced noise and return path
  9. Shielding effectiveness of cables
  10. Capacitive coupling on cables
  11. Cable as a transmission line
  12. Reflections on a transmission line
  13. Ribbon vs round cable
  14. Isolation techniques for cables
  15. Power line filtering

EMC Design Part II

System and PWB

  1. System design considerations
  2. Suppression at the source
  3. Compartmentalized shielding
  4. Power distribution on PWB
  5. Selection of decoupling capacitors
  6. Effect of trace inductance
  7. Power distribution for 2 layer system
  8. Signal layout for high frequencies
  9. Optimizing Multilayer Boards
  10. Correct order of layers
  11. Transmission line
  12. Thickness of dielectric
  13. Ground as shield
  14. Pin escape length
  15. Use of decoupling capacitors
  16. Signal routing, best practices
  17. Buried clock layout
  18. Guard band for clocks
  19. Routing of high frequencies
  20. Preferred layer groups
  21. Four-layer PWB
  22. Six-layer PWB
  23. Eight-layer Plus
  24. Too many layers?
  25. Demonstration

Susceptibility

  1. ESD as RF noise
  2. ESD test setup
  3. ESD characteristics
  4. Direct and indirect ESD
  5. ESD through cables
  6. RF Susceptibility
  7. Noise paths for RF
  8. Conducted susceptibility
  9. Power line transients

Special Topics

  1. Telephone line
  2. Local area networks
  3. Medical devices
  4. Transmitters & Receivers

Diagnostic & Demo

  1. Spectrum energy
  2. Near field probes
  3. Wire antennas
  4. Cable antennas
  5. Shielding materials
  6. Filtering materials
  7. EMC testing and debugging

Regulatory

General

  1. Intro to regulatory requirements
  2. Agencies in North America
  3. Agencies in Europe
  4. Structure of agencies
  5. Commonalities in other regions
  6. Participation in standards making

North America

  1. US requirements-digital devices
  2. Changes in FCC's policies
  3. PCs and peripherals - special case
  4. Class A or class B limits?
  5. US req. - intentional radiator
  6. Introduction to TCBs
  7. TCB Roles and Responsibilities
  8. TCB trends and statistics

European Union (EU)

  1. New Legislative Framework
  2. EMC directive 2014/30/EU
  3. Scope and exclusions
  4. Compliance path to CE mark
  5. Declaration of Conformity
  6. Generic/product specific stds.
  7. ITE standards for EMC
  8. Immunity and emissions testing
  9. FCC vs EC (CE) emission limits
  10. What is a "CAB"?
  11. What is a notified body?
  12. Technical Construction File (TCF)
  13. When to use the Type Examination route
  14. Future trends for the EU
  15. Radio Equipment Directive 2014/53/EU directive

Product Safety

Terms & Definitions

  1. Enclosures
  2. Hazards
  3. Equipment types & classes
  4. Power systems
  5. Environment

Standards & Laws

  1. North America
  2. South America
  3. Europe
  4. Nordic Countries
  5. Russia
  6. Japan, China, Korea
  7. Australia, New Zealand

Basic Safety Principles

  1. Concepts of safety
  2. Design for foreseeable misuse
  3. Approaches to product safety
  4. Prevention of hazards
  5. Containment of hazard

Design Characteristics

  1. Thermal Hazards
  2. Shock Hazards
  3. Mechanical hazards
  4. Chemical hazards
  5. Radiation hazards
  6. Ergonomics

Qualification (Type) Testing

  1. Input ratings, touch current
  2. Ground impedance, temperature rise
  3. Dielectric withstand, impact
  4. Stability, abnormal testing

Production Line Testing

  1. Dielectric withstand
  2. Ground impedance
  3. Ground continuity

What people are saying

“This 4-day seminar was very well outlined. The knowledge and experience of the course instructors along with their practical examples were a valuable part of the lecture. The written course material will also be a valuable reference”. Best Regards, Kevin (SIEMENS)
“I have attended many seminars over the past years and I must say this one with Compatible Electronics has been the best. I must say that Jeff and Shirish were both outstanding. Both of them gave answers to real world problems. If someone asked a question, both Jeff and Shirish would take the time to think about their answer and equate the answer to a real world problem that each of them has had to deal with in solving problems. In the most part I would recommend this seminar to my colleagues. I am using examples from the seminar to enhance the design of our product”. Regards, Tom Pulmonetic Systems Inc

“I wanted to thank you and your company for the EMI/EMC/ Product Safety seminar in San Diego. I honestly was not expecting to learn so much during the four days when so many of these types of company-sponsored seminars are little more than a sales pitch with some info thrown in for good measure, on the contrast, the Compatible Electronics seminar was chock full of information, good design techniques, lessons in how not to do things, and how to apply the current and forth-coming standards.

Upon my return to work I immediately found problems with a PC board we are having made for us - a ground plane directly under a common mode choke. These types of things used to not concern me, but now I understand why you shouldn’t do that”. Thanks again for a job well done! Best regards,

-Robert- Sr. Hardware Engineer Cubic

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